Broadcom Plans to Raise Up to $100B to Accelerate AI Chip Production
Chipmaking behemoth, Broadcom, is reportedly in advanced negotiations with a consortium of lenders. This group includes private equity powerhouses such as Blackstone and Apollo Global Management. The aim is to secure between $70 billion and $80 billion in debt. If successful, this could be one of the largest corporate financings ever linked to the AI surge.
Reports from Bloomberg, corroborated by CNBC’s David Faber, suggest that the deal is built around a special-purpose vehicle (SPV). It is expected to comprise a senior-secured tranche of approximately $45 billion and a junior tranche of about $35 billion. However, these figures are subject to change. The total financing discussions could potentially escalate to $100 billion.
The funds are intended to facilitate the supply of AI chips to companies such as Anthropic and other leading AI labs. This extends an alliance that Broadcom, Apollo, and Blackstone initiated in June 2026. The original AI XPV platform pledged $35 billion to augment Anthropic’s computing infrastructure using Broadcom’s bespoke chips. The ambitious goal is to deliver over 20 gigawatts of compute to top-tier AI labs by 2028.
This deal highlights the intense capital demand in the AI infrastructure race. Major tech corporations like Alphabet, Amazon, and Microsoft are also resorting to debt markets at unprecedented levels to finance their AI expansions.
Source: CNBC – Broadcom Debt Deal Expected to Reach Upwards of $70 Billion, Sources Say