Samsung Unveils Exynos 2600 Processor with Groundbreaking Heat Path Block Cooling Technology
Samsung’s recently unveiled Exynos 2600 processor brings to the table the innovative Heat Path Block (HPB) technology. This technology, announced on February 15, 2026, is set to revolutionize thermal management in mobile devices, addressing one of the most significant criticisms of previous Exynos chipsets—overheating and performance throttling.
The HPB technology employs High-k EMC material to reduce thermal resistance and enhance heat dissipation. This allows the Exynos 2600 to sustain higher performance levels for extended periods, even under demanding workloads. By fine-tuning the heat transfer path, the system enables heat to spread more efficiently, thereby maintaining a more stable processor temperature during intensive tasks such as gaming or AI processing.
Built on Samsung Foundry’s industry-first 2nm GAA process, the Exynos 2600 boasts a 10-core CPU. This results in up to a 39% performance improvement over its predecessor and 113% faster AI processing capabilities. The chip is predicted to power the Galaxy S26 and Galaxy S26+ smartphones in select markets, including Korea and Europe.
Samsung’s Galaxy Unpacked event, slated for February 25, 2026, is eagerly awaited as the new devices are anticipated to be officially unveiled.